On die voltage regulator

ABSTRACT

According to one embodiment, an integrated circuit (IC) is disclosed. The IC includes a package, a die mounted within the package, circuit components mounted on the die, and a voltage regulator mounted on the die to supply power to the circuit components.

COPYRIGHT NOTICE

[0001] Contained herein is material that is subject to copyrightprotection. The copyright owner has no objection to the facsimilereproduction of the patent disclosure by any person as it appears in thePatent and Trademark Office patent files or records, but otherwisereserves all rights to the copyright whatsoever.

FIELD OF THE INVENTION

[0002] The present invention relates to computer systems; moreparticularly, the present invention relates to delivering power to apower sensitive system such as a computer system.

BACKGROUND

[0003] Integrated circuit components are typically powered by voltageregulators located at a remote location. Particularly, the voltageregulator is mounted on a computer system motherboard. Having thevoltage regulator at a remote location requires the power signal totravel to the die by means of a motherboard trace and a bond-wire on thepackage, which are both highly inductive. The inductance typicallyblocks high frequencies.

[0004] Often, the integrated circuit includes components that operate atvarious frequencies (e.g., the 400-500 MHz switching range).Consequently, a voltage drop exists across the inductive path because ofthe load switching current. The voltage drop is represented by theformula V=L*(di/dt). This voltage drop restricts the voltage regulation.One way to overcome this is to include de-coupling capacitors. Thede-coupling capacitors compensate for the inductance by storing andimmediately supplying energy. De-coupling capacitors on the motherboardcan help compensate for board inductance. De-coupling capacitors can beplaced on the integrated circuit die to help compensate for package anddie inductance. However, capacitors increase the die area of theintegrated circuit. Moreover, the leakage current draw of the capacitorsmay affect low process applications.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The invention is illustrated by way of example and not limitationin the figures of the accompanying drawings, in which like referencesindicate similar elements, and in which:

[0006]FIG. 1 is a block diagram of one embodiment of a computer system;

[0007]FIG. 2 is a block diagram of an exemplary voltage regulatormodule;

[0008]FIG. 3 is a block diagram of one embodiment of a voltage regulatormodule on an integrated circuit;

[0009]FIG. 4 is a block diagram of another embodiment of a voltageregulator module on an integrated circuit;

[0010]FIG. 5 is a block diagram of yet another embodiment of a voltageregulator module on an integrated circuit; and

[0011]FIG. 6 is a block diagram of yet another embodiment of a voltageregulator module on an integrated circuit, where the pass transistor ismoved off-die for power consumption/thermal reasons.

DETAILED DESCRIPTION

[0012] A voltage regulator integrated in an integrated circuit isdescribed. In the following detailed description of the presentinvention numerous specific details are set forth in order to provide athorough understanding of the present invention. However, it will beapparent to one skilled in the art that the present invention may bepracticed without these specific details. In other instances, well-knownstructures and devices are shown in block diagram form, rather than indetail, in order to avoid obscuring the present invention.

[0013] Reference in the specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention. The appearances of thephrase “in one embodiment” in various places in the specification arenot necessarily all referring to the same embodiment.

[0014]FIG. 1 is a block diagram of one embodiment of a computer system100. Computer system 100 includes a central processing unit (CPU) 102coupled to bus 105. In one embodiment, CPU 102 is a processor in thePentium® family of processors including the Pentium® II processorfamily, Pentium® III processors, and Pentium® IV processors availablefrom Intel Corporation of Santa Clara, Calif. Alternatively, other CPUsmay be used.

[0015] A chipset 107 is also coupled to bus 105. Chipset 107 includes amemory control hub (MCH) 110. MCH 110 may include a memory controller112 that is coupled to a main system memory 115. Main system memory 115stores data and sequences of instructions that are executed by CPU 102or any other device included in system 100. In one embodiment, mainsystem memory 115 includes dynamic random access memory (DRAM); however,main system memory 115 may be implemented using other memory types.Additional devices may also be coupled to bus 105, such as multiple CPUsand/or multiple system memories.

[0016] MCH 110 may also include a graphics interface 113 coupled to agraphics accelerator 130. In one embodiment, graphics interface 113 iscoupled to graphics accelerator 130 via an accelerated graphics port(AGP) that operates according to an AGP Specification Revision 2.0interface developed by Intel Corporation of Santa Clara, Calif.

[0017] In addition, the hub interface couples MCH 110 to an input/outputcontrol hub (ICH) 140 via a hub interface. ICH 140 provides an interfaceto input/output (I/O) devices within computer system 100. ICH 140 may becoupled to a Peripheral Component Interconnect bus adhering to aSpecification Revision 2.1 bus developed by the PCI Special InterestGroup of Portland, Oreg. Thus, ICH 140 includes a PCI bridge 146 thatprovides an interface to a PCI bus 142. PCI bridge 146 provides a datapath between CPU 102 and peripheral devices.

[0018] PCI bus 142 includes an audio device 150 and a disk drive 155.However, one of ordinary skill in the art will appreciate that otherdevices may be coupled to PCI bus 142. In addition, one of ordinaryskill in the art will recognize that CPU 102 and MCH 110 could becombined to form a single chip. Further graphics accelerator 130 may beincluded within MCH 110 in other embodiments.

[0019] In addition, computer system 100 includes a power supply 165 anda multitude of voltage regulators that are used to provide power tovarious components within computer system 100. CPU voltage regulatormodule (VREG) 160 provides voltage to CPU 102. VREG core 170 suppliesmemory voltage for MCH 110 and memory 115. VREG core 175 supplies corevoltage for ICH 140. In one embodiment, VREG core 170 and 175 eachsupply a 1.5V supply voltage.

[0020] In a further embodiment, voltage regulators 160, 170 and 175supply voltage during normal (full power) operation and are off duringsuspend mode operation. Additionally, VREG core 170 may have analternate mode to supply stand-by power to main memory 115 duringcertain suspend modes.

[0021] VREG SUS 180 differs from the other voltage regulators in FIG. 1in that it is designed to be powered in all normal and suspend powermanagement modes. In desktop computer systems 100, VREG SUS 180 suppliespower whenever the main power supply 165 is getting AC power. In mobilecomputer systems 100, VREG SUS 180 supplies power when the PC is innormal and suspend power states and is off when the entire PC iscompletely shut down. In a further embodiment, VREG SUS 180 supplies a3.3V supply voltage.

[0022] According to one embodiment, a VREG suspend module 148 isintegrated on the chipset 107 integrated circuit within ICH 140. In afurther embodiment, VREG core 175 provides power to ICH 140 during acore power (fully on) mode, while VREG suspend module 148, along withVREG SUS module 180, provides power to ICH 140 during the suspend mode.In yet a further embodiment, VREG suspend module 148 provides a 1.5Vscaled down from a 3.3V received from VREG 180.

[0023] Having a voltage regulator on an integrated circuit providesvarious advantages. Traditionally, the suspend mode voltage regulatorhas been mounted on the computer system 100 motherboard, while feedingpower to the integrated circuit. FIG. 2 illustrates an exemplary powersupply mounted on a motherboard.

[0024] As shown in FIG. 2, the voltage regulator is located at a remotelocation from the semiconductor in which it supplies (e.g., on themotherboard), while the current load is drawn at the semiconductor die.As discussed above, having the voltage regulator at a remote locationresults in an inherent inductance composed of the package bond-wire andtraces of the motherboard. The inductance blocks high frequencyswitching.

[0025] However, the semiconductor may include circuits operating at the400-500 MHz switching range. The regulated voltage is lower because ofthis voltage drop, thus circuits may not function properly.

[0026] One solution is to include de-coupling capacitors as shown inFIG. 2. De-coupling capacitors compensate for the inductance by storingand immediately releasing energy. De-coupling capacitors on themotherboard do not compensate for inductance inside the integratedcircuit package. De-coupling capacitors placed on the integrated circuitdie helps compensate for package inductance but increase the die area ofthe semiconductor. In addition, the increased current leakage of theon-die capacitors may affect low power applications.

[0027] Therefore, a voltage regulator mounted on an integrated circuitis disclosed. FIG. 3 is a block diagram of one embodiment of VREGsuspend module 148 mounted within ICH 140. VREG suspend module 148 is anon-die voltage regulator that includes operational amplifier 300, avoltage reference circuit 310 and transistors MN0 and MN1.

[0028] Voltage reference circuit 310 generates a reference voltage(V_(REF)) off of the suspend 3.3 volt supply received from VREG SUS 180.According to one embodiment, voltage reference circuit 310 isimplemented using a resistor divider to generate a 1.5V V_(REF).However, in other embodiments other types of accurate voltage referencecircuit (such as a bandgap voltage reference generator) may be used.

[0029] In one embodiment, V_(REF) may be adjusted after manufacturingthe die (post-silicon) by changing the tap point of voltage referencecircuit 310. In a further embodiment, the adjustment is made in softwareupon receiving configuration bits from a Basic Input Output System(BIOS) during startup of computer system 100. In another embodiment, theadjustment is made by a metal change.

[0030] According to a further embodiment, a current mirror foroperational amplifier 300 is also included in the voltage referencecircuit 310 stack in order to stabilize the current through transistorMN1. The voltage developed across MN1 is used to mirror a proportionalbias current in amplifier 300. Slight variations in the voltagethreshold will affect V_(REF), but in a direction that is complementaryto the supply needs of the process corner.

[0031] Operational amplifier 300 combined with the pass transistor MN0is the main portion of the voltage regulator. In one embodiment thetransistor MN0 is implemented using NMOS transistor. However, a PMOSpass transistor design is also possible. V_(REF) determines the DCoutput voltage, V_(REGOUT), coupled to a current load. When a currentincrease occurs, V_(REGOUT) is pulled lower, below V_(REF). Operationalamplifier 300 compensates by driving a larger gate voltage on MN0, ifthe current increase is within the bandwidth of the regulator.Otherwise, the decoupling capacitors respond first to the current spike,which use their stored energy to help hold up the output voltageV_(REGOUT). The larger gate voltage recovers the output voltageV_(REGOUT), which is a closed loop system.

[0032] According to one embodiment, VREG suspend module 148 provides theoutput voltage V_(REGOUT) to an output pad at ICH 140. The signalreceived at the output pad may be used as a backup so that an VREGsuspend module 148 can drive the same signal. Alternatively, the outputsignal may be used for debugging purposes.

[0033] VREG module 148 has a much higher loop bandwidth (e.g., on theorder of 1-2 MHz), whereas a voltage regulator on the motherboardtypically has a loop bandwidth on the order of 15 kHz. Also, since theVREG module 148 is microns away from the load it is powering, instead ofinches on the board, the delay between the regulator and the load ismuch less, which leads to a faster response time. Also, with an on-dievoltage regulator, the package inductance is eliminated which againhelps the frequency response. As a result, this regulates high frequencycircuits much better than an on-board voltage regulator.

[0034]FIG. 4 is a block diagram of another embodiment of a VREG suspendmodule 148. This embodiment of VREG module 148 operates similar to theVREG module 148 described above with respect to FIG. 3. However, in thisembodiment, the pass transistor MN0 is divided into constituent pieces.

[0035] In one embodiment, VREG suspend module 148 includes post-siliconoptions for the pass transistor size MN0 to (MN0+MN1) and (MN0+MN1+MN2).One of ordinary skill in the art will appreciate that three optionsexist in the diagram, but there could be any number of post-siliconoptions. For instance, if the current is lower than expected in silicon,the pass transistor size may be adjusted to handle the lower current.Other reasons to adjust the pass transistor size include op-amp loadingand response time. The additional transistors may also be used for otherpurposes (e.g., extra V_(REGOUT) decoupling capacitance).

[0036] Further, this embodiment of suspend module 148 provides foradditional on-die decoupling capacitance. The amount of on-diedecoupling and/or compensation capacitance may be adjusted further inpost-silicon to target the suspend module 148 bandwidth at the loadoperating frequency. In one embodiment, V_(REF) may be adjusted in bychanging the tap point of the resistor stack.

[0037] Further, this embodiment of suspend module 148 provides forpost-silicon options for op-amp input/output compensation resistanceand/or capacitance (not shown). RC filters could be used to repressnoise on the reference signal and/or the op-amp output signal to furthertune the voltage variation tolerance and/or the bandwidth of the voltageregulator.

[0038] As described above with respect to voltage reference circuit 310,the post-silicon adjustments may be made in software upon receivingconfiguration bits from BIOS during startup of computer system 100. Inanother embodiment, there is a customer setting that automaticallyselects the best option based on silicon performance.

[0039] The embodiment of VREG suspend module 148 illustrated in FIG. 4regulates from the VREG SUS module 180 at all times. However, thiscauses additional power dissipation in the integrated circuit packagesince active mode currents are much greater than suspend mode currents.The load currents flow through the pass transistor MN0, which has alarge voltage drop (e.g., the voltage difference between VREG suspendmodule 180 and VREG suspend module 148). The combination of these leadsto the additional power dissipation on-die. FIG. 5 illustrates anenhanced version of the on-die voltage regulator that corrects theadditional power dissipation problem.

[0040] Referring to FIG. 5, VREG suspend module 148 includes PMOStransistors MP0 and MP1, in addition to pass transistor MN0. Accordingto one embodiment, when VREG suspend module 148 is in an active mode,the gate of transistor MP0 is activated by a CorePwrb signal. As aresult, the Core Vcc power supply is on and the suspend power is tappedfrom the core supply through transistor MP0. The power dissipation isreduced significantly because the active-mode current no longer flowsthrough the voltage drop between VREG suspend module 180 and VREGsuspend module 148.

[0041] When VREG suspend module 148 is in the suspend mode, the gate oftransistor MP0 is deactivated, and the gate of transistor MP1 isactivated by a SusPwrb signal. Accordingly, suspend module 148 operatesas described in FIG. 4 since core Vcc is not present. The powerdissipation through MN0 still exists, but it is less significant sincesuspend-mode currents are much less than active-mode currents. In afurther embodiment, control logic (not shown) is provided withincomputer system 100 to control the SusPwrb and CorePwrb signals in thesuspend/active mode transition such that no suspend well voltage droopoccurs during power state changes.

[0042]FIG. 6 shows another design of the voltage regulator that reducesthe on-die power consumption. In this design, the pass transistor MN0 ismoved off-die to reduce the on-die power dissipation (note: any type oftransistor may be used, hence the block “Board Transistor”). Recall fromthe previous description of FIG. 3 and FIG. 4 that a large amount ofpower is dissipated through the pass transistor MN0. Although the powerdissipation remains the same for the entire system, moving some of thepower dissipation off-die helps for thermal reasons. An advantage tothis over the design presented in FIG. 5 is that a separate supply totap power from is not required. This is also advantageous because a passtransistor generally costs less than an on-board voltage regulator.

[0043] As described above, the on-die voltage regulator reducesmotherboard routing congestion by eliminating a voltage regulator amotherboard. Further, having an on-die voltage regulator results incustomer savings of board trace routing and part cost of an on-boardsuspend regulator. In addition, the on-die voltage regulator is micronsaway from the load instead of inches, eliminating the package inductancewhich hurts the frequency response. Further, the on-die regulator has amuch higher loop bandwidth (e.g., 1-2 MHz instead of 15 kHz).

[0044] A further advantage of using an on-die voltage regulator isbetter PVT (process-voltage-temperature) circuit performance. The outputvoltage could be tuned, statically or dynamically, based on silicon skewand/or temperature for optimum performance. If the main goal is a higherspeed (as in a CPU), the output voltage could be set higher across anysilicon skews to achieve a higher frequency. Likewise, if the main goalis power savings (as often in chipsets), the voltage could beartificially set lower across any skew (particularly the fast siliconskew).

[0045] Whereas many alterations and modifications of the presentinvention will no doubt become apparent to a person of ordinary skill inthe art after having read the foregoing description, it is to beunderstood that any particular embodiment shown and described by way ofillustration is in no way intended to be considered limiting. Therefore,references to details of various embodiments are not intended to limitthe scope of the claims which in themselves recite only those featuresregarded as essential to the invention.

What is claimed is:
 1. An integrated circuit (IC) comprising: a package;a die mounted within the package; and circuit components mounted on thedie; a voltage regulator integrated on the die to supply power to thecircuit components.
 2. The IC of claim 1 wherein the voltage regulatorcomprises: an amplifier to provide a regulated output voltage; and avoltage reference circuit, coupled to the amplifier, to provide areference voltage to the amplifier.
 3. The IC of claim 2 wherein thevoltage reference circuit is a bandgap.
 4. The IC of claim 2 wherein thevoltage reference circuit is a resistor divider.
 5. The IC of claim 2wherein the voltage reference circuit is adjustable.
 6. The IC of claim5 wherein the voltage reference circuit is adjusted by receiving aconfiguration signal from a basic input/output system (BIOS).
 7. The ICof claim 2 wherein the voltage regulator further comprises a currentmirror coupled to the voltage reference circuit and the amplifier. 8.The IC of claim 2 wherein the voltage regulator further comprises afirst transistor, coupled to the output of the amplifier, to regulatethe output voltage.
 9. The IC of claim 8 wherein the voltage regulatorfurther comprises: a second transistor coupled to the output of theamplifier; and a third transistor coupled to the output of theamplifier, wherein one or more of the first, second and thirdtransistors are activated based upon the output current flow from theamplifier.
 10. The IC of claim 9 wherein the first, second and thirdtransistors are activated by receiving a configuration signal from abasic input/output system (BIOS).
 11. The IC of claim 8 wherein thevoltage regulator further comprises: a first capacitor coupled to theamplifier; a second capacitor coupled to the amplifier; and a thirdtransistor capacitor coupled to the amplifier, wherein one or more ofthe first, second and third capacitors are provided based upon theoperating frequency of the voltage regulator.
 12. The IC of claim 11wherein the first, second and third capacitors are provided by receivinga configuration signal from a basic input/output system (BIOS).
 13. TheIC of claim 1 wherein the voltage regulator is adaptable to be adjustedpost silicon to optimize power consumption.
 14. The IC of claim 1wherein the voltage regulator is adaptable to be adjusted post siliconto increase speed.
 15. The IC of claim 1 further comprising an outputpad coupled to the output of the voltage regulator.
 16. The IC of claim15 wherein the output pad receives an output voltage from the voltageregulator.
 17. A computer system comprising: a central processing unit(CPU); and a chipset, coupled to the CPU, having a voltage regulatorintegrated on the die to supply power to chipset circuit components. 18.The computer system of claim 17 wherein the voltage regulator comprises:an amplifier to provide a regulated output voltage; and a voltagereference circuit, coupled to the amplifier, to provide a referencevoltage to the amplifier.
 19. The computer system of claim 18 whereinthe voltage reference circuit is a bandgap.
 20. The computer system ofclaim 18 wherein the voltage reference circuit is a resistor divider.21. The computer system of claim 18 wherein the voltage referencecircuit is adjustable.
 22. The computer system of claim 21 wherein thevoltage reference circuit is adjusted by receiving a configurationsignal from a basic input/output system (BIOS).
 23. The computer systemof claim 18 wherein the voltage regulator further comprises a currentmirror coupled to the voltage reference circuit and the amplifier. 24.The computer system of claim 18 wherein the voltage regulator furthercomprises a first transistor, coupled to the output of the amplifier, toregulate the output voltage.
 25. The computer system of claim 24 whereinthe first transistor is mounted on a motherboard outside of the chipset.26. The computer system of claim 24 wherein the voltage regulatorfurther comprises: a second transistor coupled to the output of theamplifier; and a third transistor coupled to the output of theamplifier, wherein one or more of the first, second and thirdtransistors are activated based upon the output current flow from theamplifier.
 27. The computer system of claim 26 wherein the first, secondand third transistors are activated by receiving a configuration signalfrom a basic input/output system (BIOS).
 28. The computer system ofclaim 24 wherein the voltage regulator further comprises: a firstcapacitor coupled to the amplifier; a second capacitor coupled to theamplifier; and a third transistor capacitor coupled to the amplifier,wherein one or more of the first, second and third capacitors areprovided based upon the operating frequency of the voltage regulator.29. The computer system of claim 28 wherein the first, second and thirdcapacitors are provided by receiving a configuration signal from a basicsystem input/output system (BIOS).
 30. A computer system comprising: acentral processing unit (CPU); a memory control hub (MCH); and aninput/output control hub (ICH), coupled to the ICH, having a voltageregulator integrated on the die to supply power to ICH circuitcomponents.
 31. The computer system of claim 30 wherein the voltageregulator comprises: an amplifier to provide a regulated output voltage;and a voltage reference circuit, coupled to the amplifier, to provide areference voltage to the amplifier.
 32. The computer system of claim 31wherein the voltage regulator further comprises a current mirror coupledto the voltage reference circuit and the amplifier.
 33. The computersystem of claim 31 wherein the voltage regulator further comprises afirst transistor, coupled to the output of the amplifier, to regulatethe output voltage.
 34. The computer system of claim 33 wherein thefirst transistor is mounted on a motherboard outside of the ICH.
 35. Thecomputer system of claim 33 wherein the voltage regulator furthercomprises: a second transistor coupled to the output of the amplifier;and a third transistor coupled to the output of the amplifier, whereinone or more of the first, second and third transistors are activatedbased upon the output current flow from the amplifier.
 36. The computersystem of claim 33 wherein the voltage regulator further comprises: afirst capacitor coupled to the amplifier; a second capacitor coupled tothe amplifier; and a third transistor capacitor coupled to theamplifier, wherein one or more of the first, second and third capacitorsare provided based upon the operating frequency of the voltageregulator.
 37. The computer system of claim 30 further comprising afirst voltage regulator (VREG) core coupled to the MCH; a second VREGcore coupled to the ICH; and a VREG suspend module coupled to thevoltage regulator.